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Nā keʻena huna maʻamau no ka RF & Microwve Modules

'Āpana huahana

ʻO kā mākou mau mea kanu hermetic ka hopena hope loa no ka paleʻana i ka RF a me nā microwave modules-chip moderage (mcms) a me nā HMCS). Hāʻawi kēiaʻano hana kūikawā o ka uila uila , ua hōʻailonaʻo ia i ka mea kanu " Ma ka hoʻohuiʻana i kahi kumu metala kiʻekiʻe-chanctivity me kahi pā keleawe brazed a me ke kiʻekiʻe o ke kaʻa, e hana mākou i kahiʻano o loko o ka wai i loko o kaʻona a me nā meaʻino. Hōʻikeʻia kēia mau kipa e hāʻawi i ka hoʻokele ma Super Ralistal, masterly martini kūpono loa i ke kō me nā kūlana hana kiʻekiʻe.

Nā kiko pili Tech

Parameter	Specification
Application	RF/Microwave Multi-Chip Modules (MCMs), Hybrid Integrated Circuits (HMICs)
Frequency Range	DC to C/X/Ku bands and higher
Hermeticity	≤ 1x10⁻⁹ Pa·m³/s (He), meeting MIL-STD-883 standards
Base Material	Tungsten Copper (WCu), Molybdenum Copper (MoCu) for CTE matching and heat spreading
Wall & Lid Material	Kovar (e.g., 4J42, 4J34) for reliable hermetic sealing
Feedthrough Insulator	High-purity Alumina ($Al_2O_3$) Ceramic for low-loss signal transmission
RF I/O Options	50Ω impedance-matched feedthroughs available
Compliance Standards	Designed to meet GJB2440A-2006 (General specification for packages of hybrid integrated circuits)

Nā kiʻi huahana

A custom-built hermetic metal housing for high-frequency RF and microwave modules

Nā hiʻohiʻona a me nā pono

ʻO ka hilinaʻi koʻikoʻi: hāʻawi i kahi hōʻailona Hermeticʻoiaʻiʻo loa e hōʻoia i ka paleʻana i nā kumu o ka honua
ʻO ka hana kiʻekiʻe kiʻekiʻe-kiʻekiʻe-maʻamau: ʻO nā mea momona haʻahaʻa haʻahaʻa haʻahaʻa e mālama i nā hōʻailona hōʻailona koʻikoʻi no nā hōʻailona kiʻekiʻe no nā hōʻailona kiʻekiʻe.
ʻO ka hoʻokele pono Thermal: ʻO keʻano kiʻekiʻe o WCU a iʻole ka nui o ka mea i kauʻia a me nā mucum o ke kīwī i ka wela o nā'ōnaehana kiʻekiʻe.
Inherent Emi
ʻO ka hana piha loa: pono mākou e hana i ka hanaʻana i nā wāwae wāwae,ʻo Cavity nui, a me I / O I / O / O / O I / O / O / O I / O / O IT / O / O I / O IT / O IT / O IT / O IT / O IT / O IT / O IT / O IT / O IT / O I / E KOLOHE

Nā hiʻohiʻona noi

ʻO kēia mau hale hana maʻamau ke kumu no kahi ākea ākea o nā'ōnaehana holomua:

Hoʻouna / loaʻa (T / R) Modules no nā'ōnaehana Aesa Sdar
I luna / i lalo o nā mea hoʻololi no nā'ōnaehana kelepona kelepona
Kelepona uila a me ke akamai hōʻailona (Sigint) Modules
ʻO nā hōʻike hoʻokolohua kiʻekiʻe a me nā lako hana

Nā pono no nā mea kūʻai aku

Palekana i kāu ip a me ka waiwai kālā: he meaʻai,ʻo kāna mea e pale ai i ka mea i hoʻopaʻaʻia i kāu circaits kiʻekiʻe loa.
Eʻae i ka hoʻohuiʻana i ka hoʻohuiʻana: hiki i ke kahe maʻamau keʻae i ka hoʻohuiʻana o nā momi lehulehu
Hoʻemi i ka pilikia hoʻolālā: ʻoihana me kā mākou mau loea i kā mākou mau loea RF i hoʻopaʻaʻia e hoʻomohala i kahi hopena e kali ai no ka hanaʻana.

FAQ (nīnau pinepine pinepine i nā nīnau)

Q1: He aha ke kaʻina no ka hoʻolālāʻana i kahi hale hana maʻamau?

A1: Hoʻomaka ke kaʻina hana me kāu mau koi, me nā papa kuhikuhi, nā wahi o loko,ʻo nā wahi pā, a me ka hoʻonohonohoʻana. E hoʻohana i kā mākou mau mīkini hana i kēiaʻike e hoʻolālā i ka pākeke, e hana ana i nā simulate a me nā simulara

Q2: He aha keʻano o ke alaʻo Shid Shad Shading no kēia mau pahu?

A2: Hoʻohanaʻia kēia mau pahu me kahi kani mele mele mele, e hana ana iā lākou i keʻano o keʻano kiʻekiʻe.

Q3: No ke aha ke kumukūʻai o nā mea keleawe (WCU) i hoʻohanaʻia no ke kumu?

A3: WCU He mea wela loa i kēia mau noi no kēia mau noi no ka mea e hoʻohui i nā mea haʻahaʻa kiʻekiʻe ʻO ka CTE haʻahaʻa e pili pono ana i nā subsize cemic (e like me ka alumina) a me nā semiconductor chips (e like me ka samisonductors

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