ʻO ke kamaʻilio kamaʻilioʻana e pili ana i keʻano

ʻO ke kamaʻilio kamaʻilioʻana e pili ana i keʻano

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ʻO keʻano o ka uku:	T/T,Paypal
ʻO Incoterm:	FOB
Min. Kāpena:	50 Piece/Pieces
Nā kaʻa:	Ocean,Land,Air,Express
ʻO Port:	Shanghai

Hoʻokaʻaʻike

Hōʻike Huahana

Huahana Huahana

Hoʻohālike No.: OEP166

ʻO Brand: Xl

Place Of Origin: China

Hāʻawe & lawe

Nā Uniona Kuai

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Hōʻike Huahana

Hoʻokomoʻia nā mea hoʻoponopono cermic maʻamau me nā mea paʻa gula gula

'Āpana huahana

E hoʻohuli i ka hoʻolālā hoʻolālā me kā mākou mea hana cerramic customs i hoʻonohonoho i ka hoʻololiʻana i ka "mau manamana lima" gula ". E hui pū ana kēia hopena innovalitive i nā mea waiwai nui a me nā mea uila o kahi waihona curmic me ka hoʻopiliʻana i nā cardical a iʻole ke alakaʻiʻana i nā mea nānā no ka pilina paʻa. Ma ka metalazing i kaʻaoʻao o ka substrate (castellation), hana mākou i kahi pilina ma luna o ka pae kiʻekiʻe ʻO kēiaʻenehana he kī nui no ka miniatization a me ka hoʻoikaikaʻana o ka hana a me ka hoʻoikaikaʻana o ka hanauna hou a me nā modula.

Nā kiko pili Tech

Parameter	Specification
Substrate Materials	High-Purity Alumina (99.6% $Al_2O_3$), Aluminum Nitride (AlN)
Metallization System	Ti/Pt/Au (Titanium/Platinum/Gold) for superior adhesion and bondability
Gold Finger Pitch	Fully customizable (e.g., 1.0mm, 0.8mm, 0.5mm)
Surface Line/Space	As fine as 15µm / 15µm
Substrate Thickness	0.15mm to 2.0mm (typical)
Edge Metallization	Continuous wrap-around gold plating for reliable solder fillets
Integrated Options	Embedded TaN resistors, pre-deposited AuSn solder pads

Nā kiʻi huahana

A custom ceramic substrate with gold finger edge connectors for direct SMT mounting

Nā hiʻohiʻona a me nā pono

E kuhikuhi pololei i ka hoʻonohonohoʻana: E hiki i ka hoʻolālā kīleʻa gula e hiki ke kūʻaiʻia i kahi hui nui e like me kahi kūlana maʻamau.
ʻO ka hana RF Exception: Ma ka hoʻopauʻana i nā kaula kelepona,ʻoi aku ka hoʻolālāʻana i ke ala i ke ala e hoʻemi ai i ke alahaka a me ka hoʻomaikaʻiʻana i ka hana ma nā ala kiʻekiʻe.
E hoʻonui i ke ala o ke alanui
Hoʻololi i ka hoʻolālāʻana: kā mākou papa hanaʻo Laser match a me keʻano o nā kaʻina hana eʻaeʻia ai nā mea paʻakikī a me nā hoʻonohonohoʻana o nā mea e pili ana i nā'āpana uila .
ʻO ka interconnect indconnect: ʻO ka mea i hoʻopaʻaʻia, uaʻoi aku ka paʻakikī o ka pilina ma mua o keʻano o ke kelepona maʻamau.

Nā hiʻohiʻona noi

He kūpono kēiaʻenehana cunge

ʻO nā'āpana OPTICABABAL OPTICE (Tosa / Rosa)
ʻO nā modules RF mua-hopena no 5G a me nā kamaʻilio kelepona
Kākoʻo Radar Radar Modules no ka hoʻohanaʻana a me ka hoʻohanaʻana o kaʻoihana
Papa kuhikuhi i nā interconnect
ʻO nā mea hoʻokūkū kiʻekiʻe kiʻekiʻe

Nā pono no nā mea kūʻai aku

E hōʻemi i ka huiʻana o ka huiʻana: E hoʻopau i ke kumukūʻai kumukūʻai a me ka manawa e hoʻopau ai i ka hanaʻana i ka hanaʻana i kāu hana hana.
E hoʻolei i kāu nui huahana: ʻO ka hoʻolālāʻana o ka papa hana liʻiliʻi e hiki ai i kahi huahana liʻiliʻi a me ka haʻahaʻa haʻahaʻa haʻahaʻa.
E hoʻoikaika i ka hana uila: hoʻokō i ka nalowale o ka hoʻopili haʻahaʻa haʻahaʻa aʻoi aku ka maikaʻi o kāu mau hōʻailona kiʻekiʻe.
E hoʻomaikaʻi i ka EMELLL EXEFFIENTIFEFIFEFIFEFIFIFIFIFIFE: E hana i kahi ala maikaʻi a me ka hopena maikaʻi loa mai kāu mau hana ikaika.

FAQ (nīnau pinepine pinepine i nā nīnau)

Q1: Pehea keʻano o ka metalization ma ke kihi o ka substrate?

A1:ʻO kā mākou papaʻaoʻaoʻaoʻao he wahi nui loa. Hoʻohana mākou i kahi'āpana Tyri-Tyrier T / PT / AU

Q2: Hiki iāʻoe ke hana ma waena o-mau a iʻole Vias i kēia mau mea?

A2:ʻAʻole loa. Hiki iā mākou ke hoʻohui i nā laser-drilled ma o-mau mau lua e hiki ke hoʻololi pihaʻia e hāʻawi i nā mea komo ma lalo.

Q3: He aha keʻano hoʻolālā no kahi manamana lima gula maʻamau?

A3: Hoʻomaka ka kaʻina hana me kāu hoʻolālā hoʻolālā a iʻole ka papa hana hana (eg, dxf). E loiloi kā mākou mīkiniʻenehana i ka hoʻolālā no ka mea hana hana (DFM), hāʻawi i nā'ōlelo pane, a hana pū meʻoe e hoʻopau i nā kiko'ī. A laila ua aponoia ka hoʻolālāʻana, e neʻe mākou i ka prototyping a laila i ka hana piha.

Huahana keʻokeʻo