| ʻO keʻano o ka uku: | T/T,Paypal |
| ʻO Incoterm: | FOB |
| Min. Kāpena: | 50 Piece/Pieces |
| Nā kaʻa: | Ocean,Land,Air,Express |
| ʻO Port: | Shanghai |
ʻO Brand: Xl
Place Of Origin: China
| Nā Uniona Kuai | : | Piece/Pieces |
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ʻO ka mea lawe kaʻa kaʻaʻo Cerramic (CLCC) kahi papa kiʻekiʻe kiʻekiʻe-papa hana i hoʻolālāʻia e ka pae kiʻekiʻe o ka pae kiʻekiʻe a me keʻano kiʻekiʻe. Ma ka hoʻololiʻana i nā alakaʻi maʻamau me nā pahu metallid (castellations i ka periphery, e hōʻemi ana i ka nui o ka propb. Kūkuluʻia kā mākou mau clccs mai ka nui o ka multimayer kiʻekiʻe-kiʻekiʻe, e hāʻawi ana i keʻano nani a me ke koho no kahi hōʻailona hermetic maoli. ʻO kēia ke hana iā lākou i ka'ōnaehana kīwī kūpono loa no ka noiʻana i nā noi noi,ʻo Aerospace e nā mea hoʻokele waiwai kiʻekiʻe.
Hāʻawi mākou i kahi Portfolio ākea o nā pahu Clcc i nā wāwae o kaʻoihana-maʻamau.
| Parameter | Specification |
|---|---|
| Lead Count | 4 to 100 |
| Typical Pitch | 1.27mm, 0.5mm |
| Body Material | Multilayer Alumina (Al₂O₃) Ceramic |
| Terminal Plating | Nickel (Ni) / Gold (Au) for excellent solderability |
| Sealing Method | Hermetic (Au-Sn Solder or Seam Weld) or non-hermetic (Epoxy) |
| Chip Mounting | Wire bonding or flip-chip |
| Compliance | Designed to meet relevant MIL-STD-883 reliability standards |
Hāʻawi ka hoʻolālā alakaʻi i kekahi o nā mea kiʻekiʻe loa i loaʻa i nā mea kiʻekiʻe loa, eʻae iāʻoe e hōʻemi nui i ka wāwae o kāu pcb i hoʻohālikelikeʻia ai i nā pahu paʻi.
ʻO ka hoʻomehanaʻana o nā hua e alakaʻi i nā hopena parasitic haʻahaʻa haʻahaʻa a me ka hiki. Hāʻawi kēia i kahi ala hōʻailona maʻemaʻe, e hana ana i ka clcc i kahi koho koʻikoʻi no RF, microwave, a me ke kiʻekiʻe kiʻekiʻe-kiʻekiʻe.
Hāʻawi ke kino o ke kino i kahi ala maikaʻi loa i ka icmal Hiki ke mālamaʻia ka wela ma waena o nā'āpana a me nā mea kūʻai aku a me nā mea kūʻai aku i loko o ka pcb, e mālama ana i ka mea hana.
ʻO ka pohi,ʻo Monoelithic Ceramic Design a me ka hiki ke hana i kahi sinallelo maoli maoli no ka paleʻana i nā pale pale no nāʻano loea.
Q1: He aha ka hana nui i ka wā e kūʻai aku ai i nā mea clip clcc?
A1:ʻO ka hoʻokūkū nui e hoʻokele nei i ke koʻikoʻi o ka Thermo-Mechanical ma waena o ka pakali a me ka pcb No nā clics nui, he mea nui e hoʻohana i kahi mea hana pcb me kahi cte cteclicity a iʻole ka hanaʻana i nā mea kūʻai aku ma lalo o keʻano o ke kālā
Q2: He aha kaʻokoʻa ma waena o kahi clcc a me kahi qfn (quad blat no-alakaʻi)?
A2:ʻO kaʻokoʻa nui ka mea nui o ke kino. Ua hanaʻia kahi crcc o ka chemic, e hāʻawi ana i ka hana maikaʻi loa a me ke koho no ka hōʻailona hermetic. ʻO kahi QFN COPN (PQFN) kahi kumukūʻai haʻahaʻa haʻahaʻa, kūponoʻole i nā palapala noi Ua kohoʻia nā clccs no nā'ōnaehana kiʻekiʻe a me nā'ōnaehana kiʻekiʻe.
Q3: Hiki i nā Clccs kahi pākeke i lalo o lalo?
A3:ʻAe. He nui nā hoʻolālā cliff hoʻolālā e hoʻopili ai i kahi pā nui, metallized'āina / thermal hoe ma lalo o ka pahu. Hiki ke kūʻaiʻia kēia paila i ka PCB e hana i kahi ala maikaʻi loa, haʻahaʻa haʻahaʻa haʻahaʻa no nā hana kiʻekiʻe.
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