ʻO nā hale hoʻopaʻa uila uila

ʻO nā Substrate Ceramic Kiʻekiʻe no ka Packaging Electronics hilinaʻi kiʻekiʻe

Ma ke ʻano he pōhaku kihi no ka uila uila hou, hāʻawi kā mākou mau substrate seramika kiʻekiʻe i kahi kumu paʻa a hilinaʻi no ka hui ʻana a me ka hoʻohui ʻana i nā mea uila koʻikoʻi. Hoʻolālā ʻia no ka hana ʻoi aku ka maikaʻi, hāʻawi kēia mau substrates i kahi hui like ʻole o ka insulation uila maikaʻi loa, ke kū ʻana o ka wela kiʻekiʻe, a me ke kūpaʻa kemika. Hana mākou i ka nui o nā Ceramic Substrates mai nā mea e like me Alumina, Aluminum Nitride, a me Zirconia, nā mea a pau e hōʻike ana i nā papa maʻalahi, kiʻekiʻe kiʻekiʻe i mākaukau e lawe a hoʻohui i kāu mau mea koʻikoʻi loa.

Nānā Huahana

I ka ʻoihana uila wikiwiki, ʻo ka hana a me ka hilinaʻi ka mea nui. Hoʻohana ʻia kā mākou substrates seramika ma ke ʻano he kahua koʻikoʻi no ka nui o nā noi, mai nā kaapuni hoʻohui paʻakikī a me nā modula mana kiʻekiʻe i nā mea ʻike kikoʻī. ʻAʻole lākou he kākoʻo mechanical wale nō; ʻO lākou kahi hopena i hoʻohui ʻia e hāʻawi ana i ka hoʻokele wela koʻikoʻi no ka mālama ʻana i nā mahana hana paʻa, e hōʻoia ana i ka lōʻihi a me ka hana kiʻekiʻe o kāu mau mea uila. Me ka ikaika mechanical maikaʻi a me ke kū'ē i ka vibration, hōʻoia kā mākou substrates i ka hana uila paʻa ʻoiai i nā wahi hana koi loa.

Nā mea nui a me nā pono

• ʻO ka Insulation Electrical Exceptional: Kāohi pono i ka hoʻopili ʻana a me ka pōkole pōkole ma waena o nā ʻāpana, e hoʻomaikaʻi nui i ka hilinaʻi a me ka paʻa o ka ʻōnaehana.
• Hoʻokele Thermal Superior: Hāʻawi i ka dissipation wela maikaʻi loa, kahi mea koʻikoʻi no ka mālama ʻana i ka hana a hoʻolōʻihi i ke ola o nā mea uila mana kiʻekiʻe.
• Kūlana Kūlana Kiʻekiʻe: Mālama i ka hoʻolālā a me ka uila i nā kūlana hana kiʻekiʻe, e kūpono ana i nā noi noi e like me Automotive Electronics Packaging .
• Mechanical Robustness: Loaʻa i ka ikaika mechanical kiʻekiʻe a me ke kūpaʻa haʻalulu, e hōʻoiaʻiʻo ana i ka hana paʻa i nā ʻoihana koʻikoʻi, automotive, a me ka aerospace.
• ʻAʻole inertness: Kūʻē nui i ka ʻino kemika, e pale ana i nā hui uila mai nā kumu kūlohelohe.
• Kiʻekiʻe-Dimensional Accuracy: Hana ʻia me ka laumania, a me nā ʻili a me nā ana kikoʻī, e hāʻawi ana i kahi kumu kūpono no nā kaʻina hana hui automated.

ʻIkepili ʻenehana

• Nā Mea Pono: Aluminum Nitride (AlN), Alumina (Al₂O₃, 96% -99.6%), Zirconia (ZrO₂), Boron Nitride (BN)
• Loaʻa nāʻano: Electrothermal Ceramics, High-Frequency Ceramics, Insulating Ceramics, Dielectric Ceramics.
• Nā Ana Nui: Loaʻa nā nui maʻamau, e ʻoluʻolu e nīnau me kāu mau koi kikoʻī.
• Mānoanoa: Mai 0.25mm a 5mm, me ka mana hoʻomanawanui.
• Hoʻopau i ka ʻili: E like me ka puhi ʻia a i ʻole ʻia i kahi haʻahaʻa haʻahaʻa o ka ʻili (Ra <0.1 μm) no nā noi kiʻiʻoniʻoni lahilahi.
• Nā Koho Metallization: ʻO ke kiʻiʻoniʻoni mānoanoa (Silver, Gold, PdAg) a me nā kiʻiʻoniʻoni lahilahi (Ti/Pt/Au) metala no ka hana ʻana i nā ala conductive a me nā pads.

Nā hiʻohiʻona noiʻi

ʻO kā mākou mau ʻāpana seramika ke kumu hilinaʻi no ka lehulehu o nā ʻōnaehana uila holomua:

• Integrated Circuits (ICs): ʻO ke kumu kūpono no ka Ceramic IC Packaging , hāʻawi i ke kākoʻo a me ka pilina uila no ka make semiconductor.
• Mana Electronics: Hoʻohana ʻia i nā modules mana (IGBTs, MOSFETs) no nā kaʻa uila, nā mana ʻoihana, a me nā lako mana kahi e koʻikoʻi ai ka hoʻokele wela.
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He mea nui ma

no nā mea hoʻonui, kānana, a me nā antenna, kahi e pono ai ka nalowale haʻahaʻa a me ka paʻa.
• Nā Nani: Hāʻawi i kahi kahua paʻa a hermetic no nā mea ʻike like ʻole, me ke kaomi, ka wela, a me nā mea ʻike kinoea e hana ana i nā kūlana paʻakikī.
• Optoelectronics: Hoʻohana ʻia e like me nā submounts no nā LED mana kiʻekiʻe a me nā diodes laser, e hōʻoiaʻiʻo ana i ka wehe ʻana o ka wela i ka High-power Laser Packaging .

Nā ʻanuʻu maʻalahi i kāu hoʻonā substrate maʻamau

1. Kūkākūkā Kūkākūkā: Kaʻana like i kāu mau kikoʻī papahana, nā kaha kiʻi, a me nā koi hana me kā mākou hui ʻenehana loea.
2. Koho Mea & Hoʻolālā: Kōkua mākou iā ʻoe i ke koho ʻana i nā mea seramika maikaʻi loa a me ka hoʻolālā substrate e hoʻokō i kāu mau pono ʻenehana a me kāu kālā.
3. Prototyping & Validation: Hana mākou a hāʻawi i nā prototypes kiʻekiʻe no kāu hoʻāʻo ʻana a me ka hōʻoia hoʻolālā.
4. Scale to Production: Ma hope o kāu ʻae ʻia, hoʻololi maʻalahi mākou i ka hana kiʻekiʻe, ʻoi aku ka maikaʻi e kākoʻo i kāu papa hana.

Nā nīnau i nīnau pinepine ʻia (FAQ)

ʻO wai ka mea keramika maikaʻi loa no kaʻu noi?

ʻO ke koho e pili ana i kāu mau koi nui. No ka hoʻokō wela loa, ʻo Aluminum Nitride (AlN) ke koho maikaʻi loa. No ka hoʻonā maʻalahi a me ke kumu kūʻai me nā waiwai maikaʻi a puni, ʻo Alumina (Al₂O₃) ke kūlana ʻoihana. Hiki i kā mākou hui ke kōkua iā ʻoe e hana i ke koho kūpono.

He aha ka pōmaikaʻi o ka ʻili o ka substrate i poni ʻia?

He mea nui ka ʻili i poni ʻia, ʻeleʻele loa no nā noi e koi ana i ka metallization kiʻiʻoniʻoni lahilahi. Hāʻawi ia i ka hoʻopili maikaʻi ʻana, ka wehewehe laina ʻoi aku ka maikaʻi, a me ka hana kiʻekiʻe kiʻekiʻe.

Hiki iā ʻoe ke hāʻawi i nā substrates me nā lua i kālai ʻia a i ʻole nā ​​ʻano paʻakikī?

ʻOiaʻiʻo. Hoʻohana mākou i ka mīkini laser precision a me ka CNC grinding no ka hana ʻana i nā substrates me nā geometries paʻakikī, me nā puka-puka (vias), cavities, a me nā outline maʻamau e kūpono i kāu kikoʻī hoʻolālā pololei.

Ke kauoha a me ka Logistics

Helu kumu.: 001
Material: Aluminum Nitride (AlN) he makana mua; Loaʻa ka alumina, Zirconia, a me nā mea ʻē aʻe.
Ka nui o ke kauoha liʻiliʻi (MOQ): 5 ʻāpana
Packaging: Hoʻopili ʻia nā huahana i loko o nā pahu maʻemaʻe a paʻa i mea e pale ai i ka ʻino a me ka pōʻino i ka wā o ka lawe ʻana.
Hoʻouna: Hāʻawi mākou i nā koho hoʻouna honua maʻalahi ma o Ocean, Land, a me Air.
Uku Uku: T/T, D/P, L/C
Incoterm: FOB

E hoʻokaʻaʻike mai iā mākou e hoʻohana i ka mana o nā substrates seramika holomua no kāu papahana aʻe. E kūkulu pū kākou i ka wā e hiki mai ana o ka uila!